Artículo
De Leon, P.F.J.; Albano, E.V.; Salvarezza, R.C.; Solari, H.G. "Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode" (2002) Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics. 66(4):4
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Abstract:
An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface diffusion. This model leads to an unstable interface with the development of protrusions and grooves. Subsequently the model is extended to account for the presence of organic additives, which compete with [formula presented] for adsorption at protrusions, leading to a stable interface with scaling exponents consistent with those of the Edwards-Wilkinson equation. The model reproduces the interface evolution experimentally observed for Cu electrodeposition in the absence and in the presence of organic additives. © 2002 The American Physical Society.
Registro:
| Documento: | Artículo |
| Título: | Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
| Autor: | De Leon, P.F.J.; Albano, E.V.; Salvarezza, R.C.; Solari, H.G. |
| Filiación: | Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA), UNLP, CONICET, Casilla de Correo 16, Sucursal 4, La Plata, 1900, Argentina Departamento de Física, Facultad de Ciencias Exactas y Naturales, Universidad de Buenos Aires, Buenos Aires, 1428, Argentina |
| Palabras clave: | Additives; Chemical vapor deposition; Computer simulation; Copper; Diffusion; Electrodeposition; Interfaces (materials); Ions; Mass transfer; Mathematical models; Monolayers; Probability; Surface roughness; Atomistic model; Edwards-Wilkinson equation; Energy barriers; Growth dynamics; Surface chemistry; article |
| Año: | 2002 |
| Volumen: | 66 |
| Número: | 4 |
| Página de inicio: | 4 |
| DOI: | http://dx.doi.org/10.1103/PhysRevE.66.042601 |
| Título revista: | Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics |
| Título revista abreviado: | Phys Rev E. |
| ISSN: | 1063651X |
| PDF: | https://bibliotecadigital.exactas.uba.ar/download/paper/paper_1063651X_v66_n4_p4_DeLeon.pdf |
| Registro: | https://bibliotecadigital.exactas.uba.ar/collection/paper/document/paper_1063651X_v66_n4_p4_DeLeon |
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Citas:
---------- APA ----------
De Leon, P.F.J., Albano, E.V., Salvarezza, R.C. & Solari, H.G. (2002) . Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode. Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics, 66(4), 4.http://dx.doi.org/10.1103/PhysRevE.66.042601
---------- CHICAGO ----------
De Leon, P.F.J., Albano, E.V., Salvarezza, R.C., Solari, H.G. "Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode" . Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics 66, no. 4 (2002) : 4.http://dx.doi.org/10.1103/PhysRevE.66.042601
---------- MLA ----------
De Leon, P.F.J., Albano, E.V., Salvarezza, R.C., Solari, H.G. "Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode" . Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics, vol. 66, no. 4, 2002, pp. 4.http://dx.doi.org/10.1103/PhysRevE.66.042601
---------- VANCOUVER ----------
De Leon, P.F.J., Albano, E.V., Salvarezza, R.C., Solari, H.G. Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode. Phys Rev E. 2002;66(4):4.http://dx.doi.org/10.1103/PhysRevE.66.042601
